The first headphone to derive three independent acoustic zones from two drivers and one port hole.
A 40 mm titanium diaphragm tuned exclusively for sub-bass and midbass. Every material property chosen to extend low, hit fast, and damp cleanly.
| Diameter | 40 mm |
| Diaphragm material | Grade 5 Ti (Ti-6Al-4V) |
| Resonant frequency (Fs) | ~45 Hz |
| Operating range | 25 – 350 Hz |
| Voice coil | OFC Cu / Kapton, 8 Ω |
| Xmax linear | ±3.8 mm |
| Magnet | N52 Neodymium, dual ring |
| Sensitivity (section) | 102 dB SPL/V |
Mounted at the apex of the titanium cone, the retuned Sony carbon fibre driver handles everything from 350 Hz to 20 kHz — sealed in its own acoustic zone by the Ti cone geometry.
| Diameter | 22 mm |
| Diaphragm material | Woven CF / epoxy matrix |
| Pistonic limit | ~16 kHz |
| Operating range | 350 Hz – 20 kHz |
| Voice coil | CCAW (Cu-clad Al), 10 Ω |
| Rear loading | Zone 2 — Ti cone sealed |
| Magnet | N42 NdFeB compact stack |
| Sensitivity (section) | 106 dB SPL/V |
The port is not a compromise. It is a bass tuner, an ANC microphone channel, a mic housing, a wind shield, and a design detail — simultaneously.
| Tuning frequency (Fb) | ≈ 28 Hz |
| Rear volume (Zone 3) | ~12 cm³ |
| Bass extension | 25 Hz usable |
| Port grille material | Ceraluminesium L5 |
| Grille pattern | Radial micro-perforation |
| Hole diameter | 0.3 mm |
| Open area ratio | ~35% |
| Mic inside port | Mic A — sub-100 Hz ANC |
Each microphone receives a spectrally pre-separated signal before the DSP activates. No other headphone does this.
| Frequency response | 25 Hz – 20 kHz |
| Driver architecture | Coaxial 2-way |
| Bass driver | 40 mm Ti-6Al-4V |
| Mid driver | 22 mm CF woven |
| Crossover | Active DSP ≈ 350 Hz |
| Sensitivity | 108 dB SPL/V |
| Impedance | 18 Ω |
| THD @ 1 kHz, 90 dB | < 0.04% |
| Bass tuning | Reflex Fb ≈ 28 Hz |
| Acoustic zones | 3 independent |
| Architecture | 3-stage cascade |
| Total microphones | 20 total (10 per cup) |
| Port mic (Stage 0) | 1× MEMS — physics pre-filtered |
| FF rim array (Stage 1) | 6× digital MEMS — full perimeter |
| FF wide-area face mics | 2× wide-area MEMS — cup face |
| Feedback in-ear (Stage 2) | 1× analogue — error correction |
| Voice beamform array | 8× dedicated MEMS — AI beamforming |
| Mic types | Wide-area MEMS + Rim MEMS + Analogue |
| ANC attenuation | −52 dB peak |
| Low-freq ANC floor | 25 Hz |
| Wind rejection | Passive (port tube) + algorithmic |
| DSP node | Intel 04A (0.4 nm) |
| AON node | Intel 06E (0.6 nm) |
| Bluetooth | Core 6.0 |
| Audio codecs | LDAC, LC3plus, aptX Lossless |
| Simultaneous devices | 4 (BT 6.0 multi) |
| Config protocol | NexusLink™ 1.0 |
| LE Audio | Auracast broadcast |
| NFC pairing | SwiftTap™ NFC 2.0 |
| USB-C audio | TB6 · 24-bit / 192 kHz |
| Wi-Fi direct | 802.11be Wi-Fi 7 (6 GHz) |
| Wired | USB-C (TB6) / 3.5 mm jack |
| USB-C audio | 24-bit / 192 kHz |
| Playback (ANC off) | 62 h |
| Playback (ANC on) | 48 h |
| ANC + Klangkerne | 38 h |
| Quick charge (10 min) | 8 h playback |
| Battery type | Dual SilCa (Si-C) — one per cup |
| Wired charging | 80W SuperVOOC (USB-C TB6) |
| Wireless charging | 50W AirVOOC |
| Perf DSP node | Intel 04A |
| Efficiency node | Intel 06E |
| B&O voicing | Silicon-level coefficients |
| Crossover type | Active, driver-aware |
| Spatial audio | HRTF personalised |
| Adaptive EQ | Real-time per-driver |
| Config interface | NexusLink™ |
| Cup material | Ceraluminesium Sapphire |
| Surface hardness | Mohs 9 (corundum) |
| FGM layers | L0 – L5 (MgAl → α-Al₂O₃) |
| Port grille | Ceraluminesium etched |
| Headband | Forged Al + full-grain leather |
| Ear pad | Lambskin / memory foam |
| Weight | 264 g |
| IP rating | IP68 + IP69 |
| Colorways | 25 (dopant series) |
NexusLink is NewGen's unified device configuration protocol. Every wH105 setting lives in a single control panel accessible from any NewGen device over Bluetooth. No separate app. No cloud relay.
Choose from 25 Ceraluminesium Sapphire dopant colorways. Configure ear cushion, headband finish, B&O logo Ti finish, and accessories.
Six independent sensor modalities work in concert to detect wear state, head position, proximity, and user intent — before you touch a button.
| Infrared proximity | Dual-IR per cup — on-ear / off-ear |
| Capacitive skin sensing | Conductive ear pad lining — contact detect |
| IMU | 6-axis — 3-axis gyro + 3-axis accel |
| Acoustic presence | In-ear mic ambient level analysis |
| Pressure sensing | Air cavity pressure — seal verification |
| EarSense II™ | Real-time fit and HRTF adaptation |
| Remove → place down | Pause + ANC off + low-power 90-day standby |
| Remove → wear on neck | Pause + ambient mode — stay aware |
| Put on | Resume + restore last ANC state instantly |
| One cup lifted | TrueTransparency™ — hear surroundings |
| Speaking detected | Speak-to-Pause — ambient blend auto |
| Head nod (call) | Answer / end call via IMU gesture |
| Glasses detected | ANC seal-loss compensated in real time |
| Hat / hair detected | Pressure profile adjusted adaptively |
| Bass seal verification | In-ear mic monitors bass seal per wear |
| HRTF drift correction | Spatial audio corrected if position shifts |
| Re-seating prompt | Haptic nudge if poor seal detected |
The XM6 has 12. The wH105 has 20 — and each additional mic serves a distinct acoustic purpose Sony's layout cannot address. Each type serves a distinct physical and signal purpose that the others cannot replicate.
| Type | Digital MEMS — omnidirectional |
| Count | 1× omnidirectional MEMS |
| Frequency range seen | DC – ~100 Hz (port-limited) |
| Wind protection | Passive via port tube geometry |
| Exposure | Zero — recessed inside port |
| Type | Digital MEMS — directional |
| Rim mics (D–I) | 6× digital MEMS — full perimeter |
| Wide face mics (B/C) | 2× wide-area MEMS — cup face |
| Noise field model | 3D spatial, AI-derived |
| Pre-processing | Stage 0 pre-subtracted |
| Wind mesh | Acoustic foam + Klangkerne algo |
| Feedback type | Analogue — lowest latency |
| Feedback position | In-ear, direct canal measurement |
| Voice beamform type | Digital MEMS subset of S1 |
| Voice mic count | 8 dedicated beamform MEMS |
| Voice AI | Klangkerne neural voice isolation |
| Call separation | Sidelobe suppression −38 dB |
The wH105 is designed and tested to US MIL-STD-810H military durability standards — the same certification applied to ASUS commercial and ROG product lines. Ceraluminesium Sapphire at Mohs 9 is not decoration. It is armour.
Most headphones carry IP54 or IP55. The wH105 carries IP68 and IP69 simultaneously — the same dual certification found on OPPO's Find X8 Ultra and reserved for devices that must survive industrial water exposure.
Two independent Silicon Carbon batteries — one inside each ear cup — deliver total capacity that Li-Ion cells of equivalent volume cannot match, with charge speeds that redefine what fast means for audio wearables.