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Audio Engine · Intel × Bang & Olufsen · Intel 14A-E + 04A

Klangkerne™

Ray traced. In silicon.

The world's first fully vertically integrated audio stack on a consumer APU — now carrying SoRT, a dedicated sound-ray-tracing die, stacked directly on top. Co-engineered between Intel's silicon teams and Bang & Olufsen's acoustic engineering groups in Copenhagen.

Intel × Bang & Olufsen SoRT — Sound Ray Tracing Foveros 2.0 · ASSI 2.0 Dolby Atmos DTS:X B&O Beosonic Hallraum Output Stage Tiefton Modal Correction AcoustX Native No External Codec
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18 mm²
Base die · Intel 14A-E
7.2 mm²
SoRT die · Intel 04A
+38 µm
Stack height · Foveros 2.0
412 mW
Peak combined power
31 mW
Raw mode
1.8 mW
Idle leakage

One tile. Two dies.
Four power domains.

An 18 mm² Klangkerne base die on Intel 14A-E, and a 7.2 mm² SoRT ray-tracing die on Intel 04A, joined by a Foveros 2.0 hybrid bond at 0.4 µm pitch. Total height added to the package: thirty-eight microns.

Klangkerne began as the codec that ended codecs — mixer, DSP grid, Beosonic tuning and analog output on one tile. The second generation stacks a dedicated acoustic ray tracer directly above it. SoRT walks the same BVH the GPU uses for light, carries an 8-octave-band payload per ray, and hands a parametric impulse response across the hybrid bond into Klangkerne's FDN and convolution engines. The output stage — Hallraum — then renders that field faithfully to whatever transducer is actually on your head.

Every subsystem sits in one of four independently gated power domains. Nothing shares a rail it doesn't need, and nothing wakes unless it is addressed.

Exploded die stack — click a domain to gate it
Foveros 2.0 hybrid bond, ASSI 2.0 signalling, 0.4 µm pitch. The SoRT die (bronze) carries the Traversal Engine, Diffraction Unit, Binaural Divergence Unit and IR Assembler; the base die carries the mixer/DSP grid, Tiefton resonator bank and the Hallraum output stage.
412 mW
Total tile power
All four domains ungated. Full ray-traced acoustics, binaural divergence, and Hallraum output.

The shortest distance
between app and ear.

Legacy PC audio crosses three to five component hops before a single sample leaves the machine. Klangkerne is one.

Legacy PC Audio

App
DirectSound / WinAPI
OS Layer (~30–80ms)
Intel Smart Sound Tech
Intel HD Audio (HDA) Bus
External Codec (Realtek/Cirrus)
Analog Output
Total: 3–5 component hops, shared bus, vendor firmware stacks, external noise floor, audio latency hits 100ms+

Klangkerne Direct Path

App
Sonica™ Hardware-Direct API
Hardware-Direct (Alloy OS)
Klangkerne Tile
Analog Output
Total: Single hop, hardware-native latency, B&O-tuned signal path, sub-10ms end-to-end
Windows mode: App → WinAPI / DirectSound → compatibility header → Klangkerne (same hardware, additional OS layer)

Copenhagen tuning.
Silicon fidelity.

Beosonic 2D Sound Space
B&O's proprietary audio EQ paradigm enabling spatial sound shaping across four acoustic axes: Warm, Energetic, Bright, and Relaxed — plus fully custom parameter control. Now exposed in hardware DSP.
Spatial Audio Engine
B&O's interaural crosstalk correction algorithm optimized for headphone reproduction. Reduces crosstalk artifacts and improves stereo imaging precision from ear-level positioning in real-world acoustics.
Acoustic Tuning
Frequency response target curves, fatigue-reduction DSP filters, and multi-zone audio routing developed by B&O's acoustic engineering team in Copenhagen. Signature B&O warmth meets precision.
The Ford × Bang & Olufsen × Intel Triangle
Bang & Olufsen already ships Beosonic audio tuning in Ford vehicles — Mustang Mach-E and F-150 among others. The Eventide conglomerate includes both Ford and Bang & Olufsen as foundational partners. Klangkerne represents the next evolution of that partnership: moving proven automotive audio DSP and tuning philosophy directly into silicon on a consumer APU.

Alloy OS inherits not just co-engineering, but a proven track record of B&O's spatial audio and fatigue-reduction techniques deployed across millions of vehicles worldwide.

Rays above.
Waves below.

Geometric acoustics fails below roughly 200 Hz in small rooms — wavelengths grow to room scale, and rays stop being an honest model of sound. Tiefton is the named architectural answer.

Below the crossover, a room stops behaving like a hall of mirrors and starts behaving like an instrument: discrete standing-wave modes dominate, and no number of ray bounces will find them. So Klangkerne doesn't trace there. At bake time, an offline FEM solve runs per reverb zone and reduces each one to a modal LUT — up to 48 modes, each stored as frequency, Q, and per-band coupling gain. 288 bytes per zone. About four seconds of bake per zone on a Core 500 development machine.

At runtime, those modes drive 48 biquad resonators in Klangkerne's DSP grid, drawing 0.9 mW. The crossover to geometric ray tracing sits at 180 Hz, blended at 24 dB/oct across the 140–220 Hz region. Where the ray model fails, Klangkerne doesn't paper over the physics — it names the limit and builds for it: a debt, promoted to a subsystem.

Low-frequency response — geometric RT alone vs. Tiefton vs. blended output
Geometric ray tracing alone diverges from the measured reference below the modal region; Tiefton reproduces the modes exactly but rolls off by design above the blend band. The blended output tracks the reference across the seam.
Room modes vs. room volume — why the crossover exists
Room volume 24 m³ · bedroom
Each spike is a room mode. In small rooms the modes are sparse and audible as discrete resonances — exactly where rays fail worst, and exactly what Tiefton's resonator bank reproduces. As volume grows, modal density (Rayleigh count) smears into a continuum and geometric ray tracing becomes the honest model. The shaded band is the 140–220 Hz blend region: Tiefton below, rays above.

2.1 million triangles in.
8,400 out.

Sound doesn't need the geometry light needs. The NewGen bake tool decimates the graphics mesh 250:1 into an acoustic proxy, flags every diffracting edge, and encodes materials the way a wavefront actually meets them.

The bake emits .ablx — an acoustic BLAS the Traversal Engine walks directly. Each surface carries a 6-bit material index, per-band absorption α as eight 8-bit values, an 8-bit scattering coefficient, and a diffraction-edge flag set wherever the Diffraction Unit should evaluate UTD coefficients at runtime. A standard library ships 48 material presets — concrete, glass, carpet, foliage, the human body — extendable to 64. A full scene lands at 14–60 MB, against 400 MB–1.2 GB for its graphics counterpart, and lives in shared bLLC beside it.

Same room, two meshes — click any surface for its absorption profile
Diffraction edges shown in amber
Graphics mesh2,100,000 tris
Acoustic proxy — .ablx8,400 tris · 250:1

Dolby Atmos & DTS:X.
Rendered, not routed.

Dolby Atmos in Hardware
Atmos is an object-based spatial audio format where sounds are encoded as discrete objects with metadata (position, velocity, volume) rather than channel-locked mixed down stereo or 5.1. The Atmos renderer converts these objects into speaker feeds — traditionally a CPU-intensive task.

Klangkerne implements the full Atmos renderer in dedicated silicon, offloading the compute burden entirely from the CPU. The result: object-based spatial audio at cinema quality without CPU throttling, and with latency under 10ms — a massive improvement over software rendering (typically 50–150ms).
DTS:X & Beyond
Klangkerne also supports DTS:X object-based audio with its own unique feature set:
  • Dynamic height channel upmixing for stereo-to-immersive conversion
  • Headphone virtualization with custom HRTF profiles
  • Object audio passthrough (up to 32 discrete audio objects)
  • Real-time mix monitoring and object inspector
  • Full DTS:X creative metadata support
A signal of Eventide's media-first DNA: Alloy OS also ships with a significantly enhanced Dolby Vision 2 implementation (the metadata standard for HDR video color grading) — indicating that the OS platform takes end-to-end media production and consumption seriously, from image to sound.

The field is computed.
Hallraum makes it true.

Ray tracing in, DSP out. At ear-canal and pinna scale, sound is wave-dominated — so the output stage is not a second ray tracer. It is measured-transfer-function DSP: transducer inversion, HRTF convolution, and a codec bridge, applied to the field SoRT computed.

Hallraum knows what is on your head. First-party devices — Sony, Bang & Olufsen, OPPO, Asus — ship signed transducer profiles, handshaken over the OPPO networking tile's BT/USB negotiiation and loaded from ZAM in under 0.2 ms. The deeper the profile, the closer the rendered field gets to the computed one.

TierDevicesProfile depthAdded latency
First-party fullSony / B&O / OPPO / Asus signed profilesFull 1,024-tap FIR inversion + phase correction + individualized HRTF slot1.9 ms
First-party legacyOlder NewGen-partner devicesMagnitude-only 256-tap correction1.1 ms
Third-party knownUSB/BT-identified, community-measuredHarman target curve fit0.8 ms
UnknownGeneric fallbackDiffuse-field EQ only0.6 ms

The HRTF stage ships a 720-direction set — 2 ears × 256-tap FIR at 24-bit, about 1.1 MB per profile — with bilinear interpolation between the nearest four directions. Photogrammetry personalization applies as a delta layer over the base set. And the codec bridge encodes Dolby Atmos and DTS:X objects directly from SoRT's parametric domain: no render-to-channels-then-reanalyze double loss.

The honest limit: a non-individualized HRTF is the realism ceiling. Front/back confusion with a generic profile is a property of human hearing, not of the silicon — the hardware renders its transfer function faithfully; the function worth rendering is per-human. That is why the individualized HRTF slot exists in the first-party tier.

HRTF magnitude vs. azimuth — left ear, horizontal plane
At 500 Hz the head barely shadows; at 8 kHz the contralateral side drops more than 20 dB and the pinna carves the notches that carry front/back cues.
Binaural rendering — live demo
◎ Headphones required
45°
Azimuth
312 µs
ITD · Woodworth
6.4 dB
ILD @ 2 kHz
Drag the source around the head. Rendering runs through the browser's HRTF panner; the readouts show the same interaural quantities the BDU computes in fixed-function math — Woodworth ITD from path-length difference, head-shadow ILD per band.

Hardware-direct.
By design.

Sonica™ is Intel and Bang & Olufsen's hardware-direct audio runtime, purpose-built to expose Klangkerne's full capabilities to applications on Alloy OS. Sonica is the bridge between user software and the silicon audio engine — enabling sub-10ms latency audio I/O, spatial parameter control, and real-time DSP injection without any OS scheduling overhead or external codec intermediation. Spatial acoustics — ray-traced propagation, occlusion, binaural divergence — enters through AcoustX, which Sonica hosts natively.

Device Enumeration
Discover and manage Klangkerne input/output channels, speaker configurations, and headphone modes with hardware-level precision.
Spatial Renderer Control
Real-time manipulation of Atmos/DTS:X object positions, velocities, doppler effects, and rendering parameters.
DSP Parameter Injection
Apply Beosonic presets, custom EQ curves, B&O tuning profiles, and dynamic range processing to live audio streams with <1ms latency.
Low-Latency PCM Streams
Direct hardware-native PCM buffers (44.1kHz–384kHz/8–32-bit) with zero-copy ring-buffer management and jitter suppression.
Compressed Audio Support
Native decode/passthrough for AAC, FLAC, LDAC, aptX Lossless, LC3, and more — offloaded from CPU.
Beosonic Parameter API
Programmatic access to all Beosonic tuning axes: real-time warm/bright/relaxed balance, custom curve control, signature presets.
Hardware Attenuation Control
Precision volume management at the silicon level with 0.1 dB granularity — no digital attenuation distortion.
Multi-Zone Audio Routing
Simultaneous output to speakers, headphones, and external interfaces with per-zone parameter control and DSP chains.
Windows Compatibility: Sonica Adapter Driver
On Windows installations of Alloy OS, Sonica presents itself as a WinAPI-compatible audio driver with full WASAPI, DirectSound, and legacy MME support. Applications see a standard Windows audio device, but audio routes directly to Klangkerne hardware through Sonica's passthrough adapter layer — zero OS scheduling intervention, zero external codec coloration. Developers can use standard Windows audio libraries while transparently gaining Sonica's sub-10ms latency and B&O Beosonic DSP capabilities.

Four ways to trace a room.
One draws 118 milliwatts.

Scene: 64 sources × 32 rays × 3 bounces, 48 kHz / 128-sample blocks. The same acoustic workload run as CPU software, GPU compute, time-sliced on the GPU's RTU4 units, and on SoRT.

Power — audio workload
Motion-to-ear latency
Frame-render impact — what the acoustic workload costs the GPU
Time-slicing the GPU's RTU4 units is the worst of the four: the audio rays are cheap, but they steal ray-tracing hardware from frame rendering at exactly the wrong moments — heaviest on single-GPU handhelds. SoRT's impact is 0.0% because it never touches the render path: its scheduling domain is the 2.67 ms audio-block deadline, not the frame.
Zero watts. By absence.
A title that never links AcoustX never addresses the Traversal Engine. Its power domain never ungates — not switched off, simply never woken. There is no mode. Unaddressed silicon draws nothing but leakage: 1.8 mW.

6.5 milliseconds,
accounted for.

Motion-to-ear, full ray-traced mode. Raw mode — for titles that never invoke SoRT — closes the same distance in 2.9 ms.

Motion-to-ear waterfall — full-RT vs. raw mode
The hybrid-bond handoff — the entire cost of moving the parametric IR from the SoRT die to the Klangkerne base die — is 0.02 ms. Foveros 2.0 at 0.4 µm pitch makes the two dies, for scheduling purposes, one.

Two deep dives
from here.

Every number
justified.

Silicon & Stack
Base die18 mm² · Intel 14A-E 2.1B transistors
SoRT die7.2 mm² · Intel 04A
BondFoveros 2.0 hybrid bond · ASSI 2.0 0.4 µm pitch
Stack height increase+38 µm
Power domains4 — mixer/DSP · TE+DU · BDU+IRA · Hallraum
Peak combined power412 mW
Raw-mode power31 mW
Idle leakage1.8 mW
Acoustic Ray Tracing — SoRT
Traversal Engine96M ray-steps/s 210 mW peak
Diffraction Unit2.4M UTD edge evaluations/s
Binaural Divergence Unit512 paths/frame forked 1.08× ray overhead
IR Assembler8-frame history · 2,048-tap staging buffer
Ray budget (Core 500)6,144 ray-paths per 128-sample block 2.67 ms deadline
Motion-to-ear latency6.5 ms full-RT · 2.9 ms raw
Tiefton48 biquad resonators · 0.9 mW crossover 180 Hz
Audio Engine — Klangkerne Base
PCM sample rates44.1kHz – 384kHz · up to 32-bit
Spatial audio formatsDolby Atmos (up to 7.1.4) · DTS:X object-based
Codec supportPCM, AAC, FLAC, ALAC, LDAC, aptX Lossless, Opus, Vorbis, MP3
Signal-to-noise ratio>125 dB A-weighted · 1 kHz ref
Total harmonic distortion<0.005% THD+N @ 1kHz, −3dBFS
Dynamic range125 dB (32-bit PCM)
End-to-end latency<10 ms hardware-direct · Alloy OS
Output impedance<100Ω line-level analog
Headphone drive200mW @ 32Ω, both channels
Beosonic axesWarm / Energetic / Bright / Relaxed + custom matrix
Driver APIsSonica™ native · AcoustX · WASAPI / DirectSound adapter

Where it matters.

Audiophile Playback
Lossless streaming, vinyl simulation, and studio-mastered audio. Beosonic tuning profiles deliver signature B&O warmth. Sub-10ms latency ensures sync-perfect multichannel playback.
Studio Monitoring
Reference-grade frequency response, zero external codec coloration, and real-time DSP parameter injection. A trusted signal path for audio engineering and mastering.
Spatial Gaming Audio
Ray-traced propagation, hardware UTD diffraction and binaural rendering at 0.0% frame cost. Atmos and DTS:X objects encoded directly from the parametric domain — no CPU tax, no GPU tax.
Video Production Monitoring
Dolby Vision 2 + Atmos content audition, real-time object mixing, and B&O spatial audio validation. Full creative metadata awareness.