The world's first fully vertically integrated audio stack on a consumer APU — now carrying SoRT, a dedicated sound-ray-tracing die, stacked directly on top. Co-engineered between Intel's silicon teams and Bang & Olufsen's acoustic engineering groups in Copenhagen.
An 18 mm² Klangkerne base die on Intel 14A-E, and a 7.2 mm² SoRT ray-tracing die on Intel 04A, joined by a Foveros 2.0 hybrid bond at 0.4 µm pitch. Total height added to the package: thirty-eight microns.
Klangkerne began as the codec that ended codecs — mixer, DSP grid, Beosonic tuning and analog output on one tile. The second generation stacks a dedicated acoustic ray tracer directly above it. SoRT walks the same BVH the GPU uses for light, carries an 8-octave-band payload per ray, and hands a parametric impulse response across the hybrid bond into Klangkerne's FDN and convolution engines. The output stage — Hallraum — then renders that field faithfully to whatever transducer is actually on your head.
Every subsystem sits in one of four independently gated power domains. Nothing shares a rail it doesn't need, and nothing wakes unless it is addressed.
Legacy PC audio crosses three to five component hops before a single sample leaves the machine. Klangkerne is one.
Geometric acoustics fails below roughly 200 Hz in small rooms — wavelengths grow to room scale, and rays stop being an honest model of sound. Tiefton is the named architectural answer.
Below the crossover, a room stops behaving like a hall of mirrors and starts behaving like an instrument: discrete standing-wave modes dominate, and no number of ray bounces will find them. So Klangkerne doesn't trace there. At bake time, an offline FEM solve runs per reverb zone and reduces each one to a modal LUT — up to 48 modes, each stored as frequency, Q, and per-band coupling gain. 288 bytes per zone. About four seconds of bake per zone on a Core 500 development machine.
At runtime, those modes drive 48 biquad resonators in Klangkerne's DSP grid, drawing 0.9 mW. The crossover to geometric ray tracing sits at 180 Hz, blended at 24 dB/oct across the 140–220 Hz region. Where the ray model fails, Klangkerne doesn't paper over the physics — it names the limit and builds for it: a debt, promoted to a subsystem.
Sound doesn't need the geometry light needs. The NewGen bake tool decimates the graphics mesh 250:1 into an acoustic proxy, flags every diffracting edge, and encodes materials the way a wavefront actually meets them.
The bake emits .ablx — an acoustic BLAS the Traversal Engine walks directly. Each surface carries a 6-bit material index, per-band absorption α as eight 8-bit values, an 8-bit scattering coefficient, and a diffraction-edge flag set wherever the Diffraction Unit should evaluate UTD coefficients at runtime. A standard library ships 48 material presets — concrete, glass, carpet, foliage, the human body — extendable to 64. A full scene lands at 14–60 MB, against 400 MB–1.2 GB for its graphics counterpart, and lives in shared bLLC beside it.
Ray tracing in, DSP out. At ear-canal and pinna scale, sound is wave-dominated — so the output stage is not a second ray tracer. It is measured-transfer-function DSP: transducer inversion, HRTF convolution, and a codec bridge, applied to the field SoRT computed.
Hallraum knows what is on your head. First-party devices — Sony, Bang & Olufsen, OPPO, Asus — ship signed transducer profiles, handshaken over the OPPO networking tile's BT/USB negotiiation and loaded from ZAM in under 0.2 ms. The deeper the profile, the closer the rendered field gets to the computed one.
| Tier | Devices | Profile depth | Added latency |
|---|---|---|---|
| First-party full | Sony / B&O / OPPO / Asus signed profiles | Full 1,024-tap FIR inversion + phase correction + individualized HRTF slot | 1.9 ms |
| First-party legacy | Older NewGen-partner devices | Magnitude-only 256-tap correction | 1.1 ms |
| Third-party known | USB/BT-identified, community-measured | Harman target curve fit | 0.8 ms |
| Unknown | Generic fallback | Diffuse-field EQ only | 0.6 ms |
The HRTF stage ships a 720-direction set — 2 ears × 256-tap FIR at 24-bit, about 1.1 MB per profile — with bilinear interpolation between the nearest four directions. Photogrammetry personalization applies as a delta layer over the base set. And the codec bridge encodes Dolby Atmos and DTS:X objects directly from SoRT's parametric domain: no render-to-channels-then-reanalyze double loss.
The honest limit: a non-individualized HRTF is the realism ceiling. Front/back confusion with a generic profile is a property of human hearing, not of the silicon — the hardware renders its transfer function faithfully; the function worth rendering is per-human. That is why the individualized HRTF slot exists in the first-party tier.
Sonica™ is Intel and Bang & Olufsen's hardware-direct audio runtime, purpose-built to expose Klangkerne's full capabilities to applications on Alloy OS. Sonica is the bridge between user software and the silicon audio engine — enabling sub-10ms latency audio I/O, spatial parameter control, and real-time DSP injection without any OS scheduling overhead or external codec intermediation. Spatial acoustics — ray-traced propagation, occlusion, binaural divergence — enters through AcoustX, which Sonica hosts natively.
Scene: 64 sources × 32 rays × 3 bounces, 48 kHz / 128-sample blocks. The same acoustic workload run as CPU software, GPU compute, time-sliced on the GPU's RTU4 units, and on SoRT.
Motion-to-ear, full ray-traced mode. Raw mode — for titles that never invoke SoRT — closes the same distance in 2.9 ms.
listener.h for native listener-out rendering, compat.h for one-recompile migration of Steam-Audio-era titles. Sonoral is Intel's implementation.| Base die | 18 mm² · Intel 14A-E 2.1B transistors |
| SoRT die | 7.2 mm² · Intel 04A |
| Bond | Foveros 2.0 hybrid bond · ASSI 2.0 0.4 µm pitch |
| Stack height increase | +38 µm |
| Power domains | 4 — mixer/DSP · TE+DU · BDU+IRA · Hallraum |
| Peak combined power | 412 mW |
| Raw-mode power | 31 mW |
| Idle leakage | 1.8 mW |
| Traversal Engine | 96M ray-steps/s 210 mW peak |
| Diffraction Unit | 2.4M UTD edge evaluations/s |
| Binaural Divergence Unit | 512 paths/frame forked 1.08× ray overhead |
| IR Assembler | 8-frame history · 2,048-tap staging buffer |
| Ray budget (Core 500) | 6,144 ray-paths per 128-sample block 2.67 ms deadline |
| Motion-to-ear latency | 6.5 ms full-RT · 2.9 ms raw |
| Tiefton | 48 biquad resonators · 0.9 mW crossover 180 Hz |
| PCM sample rates | 44.1kHz – 384kHz · up to 32-bit |
| Spatial audio formats | Dolby Atmos (up to 7.1.4) · DTS:X object-based |
| Codec support | PCM, AAC, FLAC, ALAC, LDAC, aptX Lossless, Opus, Vorbis, MP3 |
| Signal-to-noise ratio | >125 dB A-weighted · 1 kHz ref |
| Total harmonic distortion | <0.005% THD+N @ 1kHz, −3dBFS |
| Dynamic range | 125 dB (32-bit PCM) |
| End-to-end latency | <10 ms hardware-direct · Alloy OS |
| Output impedance | <100Ω line-level analog |
| Headphone drive | 200mW @ 32Ω, both channels |
| Beosonic axes | Warm / Energetic / Bright / Relaxed + custom matrix |
| Driver APIs | Sonica™ native · AcoustX · WASAPI / DirectSound adapter |